Huawei's "Semiconductor Packaging" Patent Announcement
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According to Tianyancha, the "Semiconductor Packaging" patent of Huawei Technology Co., Ltd
According to Tianyancha, the "Semiconductor Packaging" patent of Huawei Technology Co., Ltd. was announced on October 31st, with the application publication number CN116982152A.
Image source: Tianyancha
The patent abstract shows that the present disclosure relates to a semiconductor packaging, which includes a first substrate, semiconductor chip, lead frame, and sealant. The lower main surface of the sealant includes a first part extending in the first plane, a second part extending in the second plane, a third part extending in the first transition zone between the first plane and the second plane, and a fourth part extending in the second transition zone between the second plane and at least one lead. The first part of the sealant and the lower main surface of the first substrate extend in the same first plane, forming the lower heat dissipation surface of the package. The dimensions of the second, third, and fourth parts of the sealant are set to maintain a first predefined minimum distance between the first part of the sealant and at least one lead.
Image source: Tianyancha
This article originates from Cailian News Agency
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