Deep research on the lithography equipment industry: the pinnacle of semiconductor equipment, the pinnacle of icebergs waiting for the dawn of domestic production
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/1 1.1 1958
/
1
1.1
1958 .Gordon Moore 18 24
1960

, 1950 ,
1. 2. 3. 4.5. 6. 7. 8.
ASML 5000 , MOS IC 5 , 30 , 24 , 6 ~ 8 40% ~50%

PhotoresistX 3 Mask Reticle Ar/Ne/XeKr/NeF2/Kr/NeF2/Ar/Ne
1.2
/ X /

1.2.1 /Aligner
1961 GCA 3 SiemensGCAKasper Instruments Kulick Soffa 4004/3101/ EVG, MEMS
1.2.2 /Stepper
Perkin Elmer 1973 Micralign100 0.17 2 Micralign 10% 70%
1978 , GCA 4:1 5:1 101 0.25 g i KrF
2009 SSB500 2015 40%
1.2.3 Scanner
0.25 26mm x 8mm 26mm x 33mm

I KrFArFEUV 26mm x 8mm ASML 2001
1.3
1990 SVGL Micrascan I DUV 7 1990 30
R=K1/NaK1 ; Na
SVGL 1993 Micrascan II 250nm 350nm, 1.351995 248nm KrF 250nm 1999 193nm ArF NSR-S302A 180 193nm 157nm F2 ASML ASML 2004 ArFiTWINSCAN AT 1150i

134nm NA 1.35half-pitch 38 28 22
DE 28 ---LFLELELE LELELESAMP 14/16nm-7nm
LELE
5 EUV 7 SAQP 193nm 5 EUV 10-7

DUV EUV 13.5nm Sn EUV Bragg reflector Zeiss EUV ASML EUV NXE 3600D 13 3-5
1.4
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2
2.1
OPCSMO
2.2
i 365nm 254579nm i 365nmH 405nm G 436nm

KrF ArF/ArFi KrArF2Cl2 DUVKrF ArF 248nm193nm Cymer GIGAPHOTON 120W 6000Hz 100150ns
DUV CFF , 19 pre-ionization 10mm laser pulse F 600
-

EUV EUV CO2 LPP EUV 7.5-13 50000K 13.5nm ,
EUV EUV EUV NXE 3400C 250w, 300w High-NA 500w
2.3

DOE 2010 SMO SMO SMO SMOOPC
OPC SMO 180 OPC
SMOOPC 4:1 4 DUV
64 /EUV 1

OPCSMO
EUV 13.5 EUV EUV / 2-3nm /
2.4
2000 ASML TWINSCAN
100WPH ASML 200WPH 300WPH

ATHENA TISTIS TIS TIS TIS ATHENA
ArF 1.4nm 1m/s 30m/s /
ArFi 100nm
3
3.1
24%
2021 181 2022 201 2021 30

2020 IC Insights 2020-2022 4926 6548
5 EUV DRAM 1A EUV 3D NAND ArFi EUV EUV 1
3.2 ASML
ASMLNikonCanon TOP3 90% ASML EUV ASML ArF KrF Nikon ArF i-ine

ASML 79.4Nikon Canon 10.4 10.2 Canon 2021 2137 19.6 67 Nikon 2112 19.37 46 ASML 2021 186
3.3 ASML
ASML 1984 ASML PAS 2000 1985 100 ASML 1986 PAS 2500 ZEISS
1988 ASML 5 ASML 1991 ASML PAS 5500 1995 ASML 2001 TWINSCANTWINSCAN XT 2010 ASML EUV NXE 3100 EUV
ASML TSMC ASML ASML ASML ASML EUV ASML EUV ASML 39 23% EUV 13.8 EUV
ASML Cymer EUV ASML VDLAallbertsTrumpfProdrive

3.4
1960 109 65 1978 JK-1 1980 1981 JKG-3 1985 BG-101 GCA 4800DSW 80 90
2002 SMEE 863 100 Arf 863 02 2016 IC 600 90 110 280
6 80% 40% FPD MEMSLEDPower Devices
SSX600 IC 90nm110nm280nm 8 12

SSB500 200mm/300mm Flip ChipFan-In WLPFan-Out WLP 2.5D/3D BumpingRDL TSV
SSB300 6 HB-LEDMEMS Power Devices SSB200 AM-OLED LCD TFT 2.5 6 TFT 6
ASML
4
4.1 IC
AR

3D
40%
2021 2022 2022 -2.6 -3.6 2023
3D AR AR/VR AR-HUD AR-HUD

4.2
2021 3.0 %
CamtekKLA
4.3
2002 offlineI-lineKrF 2022 11 30 ArF
2022 0.95 2022 8 5 ArF ArF ArF

4.4
2006 4 2018 OCD() CD-SEM OCD
4.5
2005 2013 2014 2022 12 29 ArF Track Ultra LITH 300 4 12 8 8 12 12 300 400
4.6
FFU 14 28 ArFi ISO Class 1 EFU ULPA

4.7 ASML
1990 2008 3 LBO BBO Nd:YVO4 AR/VR
++
4.8
2007 9 ASML 2022 1.27 0.94
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